What are the advantages of using tungsten wire as diamond wire busbar?
As one of the core consumables in the silicon wafer cutting process, the cutting effect of diamond wire is mainly affected by the thickness of the product, the performance of the busbar and the cutting method. Generally speaking, the thinner the diamond wire or the higher the comprehensive performance of the busbar, the better the cutting effect. According to China Tungsten Intelligent Manufacturing, the most common diamond wire busbar on the market is high-carbon steel wire. However, as silicon wafers develop towards larger sizes and thinner sheets, high-carbon steel wire is gradually replaced by tungsten wire.
