What is the processing technology of industrial silicon?
Industrial silicon refers to the application of silicon in industry. Silicon processing technology refers to the process of processing silicon materials into various required shapes and sizes. Common silicon processing includes cutting, grinding, polishing, coating, etc.
| Grade | Chemical composition(%) | ||||
| Si | Fe | Al | Ca | P | |
| > | ≤ | ||||
| 1515 | 99.6% | 0.15 | - | 0.015 | 0.004 |
| 2202 | 99.5% | 0.2 | 0.2 | 0.02 | 0.004 |
| 2203 | 99.5% | 0.2 | 0.2 | 0.03 | 0.004 |
| 2503 | 99.5% | 0.2 | - | 0.03 | 0.004 |
| 3103 | 99.4% | 0.3 | 0.1 | 0.03 | 0.005 |
| 3303 | 99.3% | 0.3 | 0.3 | 0.03 | 0.005 |
| 411 | 99.2% | 0.4 | 0.04-0.08 | 0.1 | - |
| 421 | 99.2% | 0.4 | 0.1-0.15 | 0.1 | - |
| 441 | 99.0% | 0.4 | 0.4 | 0.1 | - |
| 553 | 98.5% | 0.5 | 0.5 | 0.3 | - |
Silicon processing technology mainly includes the following steps:
1. Cutting: Silicon materials usually exist in the form of crystals and need to be cut into appropriate shapes and sizes. Common cutting methods include wire cutting, cutting, etc.
2. Grinding: The cut surface of silicon materials is usually rough, and it needs to be polished to make its surface smooth. The grinding process usually uses grinding machinery and grinding fluid.
3. Polishing: After grinding, the surface of the silicon material may still have tiny flaws and unevenness, which requires polishing. Polishing can improve the surface finish and brightness of the silicon material.
4. Cleaning: After completing the above processes, the silicon material needs to be cleaned to remove oil and impurities on the surface to ensure the quality of the product.
5. Coating: Sometimes, in order to increase the function and service life of the silicon material, its surface can be coated. Coating can improve the wear resistance, corrosion resistance and optical properties of the silicon material.
The above are common steps in the silicon processing technology, but the specific processing technology will vary depending on the application field, product requirements and the performance of the silicon material. For example, the processing technology of silicon wafers is for the semiconductor manufacturing field, mainly including cutting into wafers, chemical mechanical polishing, cleaning and thin film coating. The processing technology of silicon optical components pays more attention to the optical performance and precision of the surface, and requires high-precision grinding and polishing processes.
In general, silicon processing technology is a complex process that requires comprehensive consideration of the performance characteristics of silicon materials, processing procedures and product requirements, and the use of scientific and reasonable process methods to achieve precise processing of silicon materials to meet the needs of various industrial fields.